Die Attach - Flip Chip Technology at die-attach.net

Datacon as a leading equipment supplier in the die attach advanced packaging technology is offering you the ideal solution as well for your die attach applications as for your Flip Chip applications.

Company history, perspectives Datacon Semiconductor Equipment GmbH has produced production equipment for the semiconductor industry since its incorporation in 1986. The successful introduction of a unique new machine platform concept to the European market in 1995 and to the American and Asian markets in 1998 has transformed Datacon into a global player in the semiconductor industry. Datacon pioneered the concept of modularity and flexibility for the die bonder equipment market. Since 1998 Datacon has been active worldwide.